Asm wire bonder manual

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Its main application areas include medical systems for health monitoring, human wellbeing and systems for environment and water that include packaging and integration of bio dies and a variety of sensors and microsystems.Īdditionally to research, the laboratory provides a corresponding service in related fields, including micro-assembly and advanced packaging. Micro-assembly, interconnection methods and advanced packaging.

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Design of miniaturised electronic circuits.Energy harvesting and ultra-low-power electronic devices and circuits.Microsys conducts inter-disciplinary research in the cutting-edge fields off: Hesse BJ653 in Microsys Clean Room facility. The Microsys team consists of 15 skillful members among of them 10 are highly educated researchers (including 2 professors and 4 Ph.D. It was created in 2007 with the support of Walloon Government and European Regional Development Fund (ERDF). Microsys is a laboratory belonging to the Montefiore Institute (Department of Electrical Engineering and Computer Science) of the University of Liège. This versatile, modular machine supports all commonly used wire bonding techniques and wire materials for both fine and heavy wire or ribbon applications. To address their future demanding wire bond applications, the MICROSYS lab of the University of Liège recently invested in a new Hesse BJ653 automatic wire bonder.

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